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材料特點(diǎn)：

1.無(wú)鉛高Tg材料  

2.材料Tg≥170°C(DSC),Td≥352。C  

3.與FR-4制造工藝兼容  

4.更低Z-CTE及高耐熱信賴(lài)性,良好的抗CAF能力 

Material Characteristics

1.Lead free high Tg material

2.TG≥170 °C (DSC),TD≥352。C

3.Compatible with FR- 4 manufacturing process

4.Lower Z-CTE and high heat-resistant reliability,

excellent CAF resistance

產(chǎn)品應(yīng)用：

高多層板、背板、服務(wù)器、網(wǎng)絡(luò)通訊  

對(duì)等材料:IX-X8XX. 

Product Application

High multi-layer board, backplane, server, network

communication

Equivalent material: |X-X8XX